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  1. Adhesive die coating with interposer bonding process.
  2. Pick & Place integration.
  3. CCD alignment system.
  4. Die coating process.
  5. Thermo compression die bonding.
  6. Data traceability and report generation function.
  7. Customizable equipment communication functionality.
  8. Operation software is customizable based on user requirements.
  9. Complete training and after-service support provided.