1. Home/
  2. Application/
  3. Semiconductor Industry/
  4. Automatic Die Bonder

Automatic Die Bonder

Contact Us
    Model : 0115-2-4
    • Adhesive Die coating with interposer bonding process 
    • Pick & Place
    • CCD alignment
    • Die coating 
    • Thermo compression die bonding. 
    • Data traceability and report function. 
    • Customize equipment communication function is available.
    • Operation software can be based on user requirements.
    • Complete training and after service support. 
    Back